HUSSEIN AL-SAID, Shymaa; Y.M. AL-MURSHEDI, Azhar. Copper electrodeposition using a novel Type IV deep eutectic solvent. Applied Chemical Engineering, [S. l.], v. 8, n. 2, p. ACE-5674, 2025. DOI: 10.59429/ace.v8i2.5674. Disponível em: https://ace.as-pub.com/index.php/ACE/article/view/5674. Acesso em: 10 jul. 2025.