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Prof. Sivanesan Subramanian

Anna University, India

 

Prof. Hassan Karimi-Maleh

University of Electronic Science
and Technology of China (UESTC)

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Home > Archives > Vol. 8 No. 2(Published) > Original Research Article
ACE-5674

Published

2025-06-28

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Vol. 8 No. 2(Published)

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Original Research Article

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Copyright (c) 2025 Shymaa Hussein Al-Said, Azhar Y.M. Al-Murshed

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How to Cite

Hussein Al-Said, S., & Y.M. Al-Murshedi, A. (2025). Copper electrodeposition using a novel Type IV deep eutectic solvent. Applied Chemical Engineering, 8(2), ACE-5674. https://doi.org/10.59429/ace.v8i2.5674
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Copper electrodeposition using a novel Type IV deep eutectic solvent

Shymaa Hussein Al-Said

Thi-Qar General Directorate of Education, Ministry of Education, Thi-Qar, Iraq

Azhar Y.M. Al-Murshedi

Department of Chemistry, Faculty of Education for Girls, University of Kufa, Kufa, 540011, Iraq


DOI: https://doi.org/10.59429/ace.v8i2.5674


Keywords: deep eutectic solvents; copper; electrodeposition; FESEM; AFM


Abstract

The research aimed to develop a new deep eutectic solvent (DES) composed of a mixture of lithium chloride and 1,3-propanediol, mixed at a 1:4 molar ratio, and used it for testing of electroplating of copper. Structural and electrochemical properties of copper electrolytes were determined with and without the use of the additives by using various electrochemical techniques, including cyclic voltammetric (CVs) measurements. Physical properties of the additive-free and additive-dispensed propanediol-based DES, such as electrical conductivity, were determined. The intent of this analysis was to determine how the additives present in the solvent altered the dissolving properties of the solvent, thus changing the electroplating process. The research further extends the knowledge of the newly introduced DES with respect to its impact on copper electrodeposition on nickel substrates. This evaluation was undertaken both with and without additives in order to assess their impact on the electroplating process. Important properties of the deposited copper, including thickness, surface shape, and surface roughness, were measured and compared. Finally, more sophisticated methods have been used to gain a deeper understanding of the copper deposits. The surface morphology of the deposits was analyzed by field emission-scanning electron microscopy (FESEM), and atomic force microscopy (AFM) was particularly useful in ascertaining the surface roughness. These methods enabled the observation and measurement of the microstructural variances of the copper deposits produced in different experimental setups.


References

[1]. Abbott AP, Capper G, Davies DL, Munro HL, Rasheed RK, Tambyrajah V. Preparation of novel, moisture-stable, Lewis-acidic ionic liquids containing quaternary ammonium salts with functional side chainsElectronic supplementary information (ESI) available: plot of conductivity vs. temperature for the ionic liquid formed from zinc chloride and choline chloride (2∶ 1). See http://www. rsc. org/suppdata/cc/b1/b106357j. Chem Commun. 2001(19):2010-1

[2]. Dong H, Zhang Z, Qiu Z, Tang D, Shu J. Insight into the molecular structure, interaction, and dynamics of aqueous reline deep eutectic solvent: A nuclear magnetic resonance investigation. The Journal of Physical Chemistry B. 2023;127(4):1013-21

[3]. Sapir L, Harries D. Restructuring a deep eutectic solvent by water: The nanostructure of hydrated choline chloride/urea. Journal of Chemical Theory and Computation. 2020;16(5):3335-42

[4]. Di Pietro ME, Hammond O, van den Bruinhorst A, Mannu A, Padua A, Mele A, Gomes MC. Connecting chloride solvation with hydration in deep eutectic systems. Physical Chemistry Chemical Physics. 2021;23(1):107-11

[5]. Nordness O, Brennecke JF. Ion dissociation in ionic liquids and ionic liquid solutions. Chem Rev. 2020;120(23):12873-902

[6]. Wang Y-L, Li B, Sarman S, Mocci F, Lu Z-Y, Yuan J, Laaksonen A, Fayer MD. Microstructural and dynamical heterogeneities in ionic liquids. Chem Rev. 2020;120(13):5798-877

[7]. Al-Suraify SMT. Synthesis and characterization of new heterocyclic compounds in corporating heterocyclic moiety derived from 3-chloro-1-methyl-1h-indazole. Biochemical and Cellular Archives. 2020;20:4127-34

[8]. Al-Suraify SMT, Hussien LB. Synthesis and characterization of new compounds derived from 1H-indol-5-ylamine. Applied Nanoscience (Switzerland). 2023;13(3):2083-92.10.1007/s13204-021-02080-3.

[9]. Ghaffari F, Zafarani-Moattar MT, Shekaari H. Harnessing the power of natural deep eutectic solvents (choline chloride/sucrose) and polypropylene glycol in the formation of aqueous biphasic systems and the application of these systems in drug extraction. RSC advances. 2024;14(18):12349-59

[10]. Al-Suraify SMT. Synthesis and characterization of novel compounds derived from 6-methyl-2,6 dihydro[1,2,4-triazino[4,3-b] indazol-3(4h)-one. International Journal of Pharmaceutical Research. 2020;12:1504-17.10.31838/ijpr/2020.sp1.233.

[11]. González-Campos JB, Pérez-Nava A, Valle-Sánchez M, Delgado-Rangel LH. Deep eutectic solvents applications aligned to 2030 United Nations Agenda for Sustainable Development. Chemical Engineering and Processing-Process Intensification. 2024;199:109751

[12]. Song Y, Chandra RP, Zhang X, Saddler JN. Non-productive celluase binding onto deep eutectic solvent (DES) extracted lignin from willow and corn stover with inhibitory effects on enzymatic hydrolysis of cellulose. Carbohydr Polym. 2020;250:116956

[13]. Płotka-Wasylka J, De la Guardia M, Andruch V, Vilková M. Deep eutectic solvents vs ionic liquids: Similarities and differences. Microchem J. 2020;159:105539

[14]. Al-Suraify SMT, Mekky AH, Husssien LB. Synthesis of new nitrogenous derivatives based on 3-chloro–1-methyl-1H-indazole. International Journal of Pharmaceutical Research. 2020;12:793-802.10.31838/ijpr/2020.SP1.124.

[15]. D'Agostino C, Harris RC, Abbott AP, Gladden LF, Mantle MD. Molecular motion and ion diffusion in choline chloride based deep eutectic solvents studied by 1 H pulsed field gradient NMR spectroscopy. Physical Chemistry Chemical Physics. 2011;13(48):21383-91

[16]. Hansen BB, Spittle S, Chen B, Poe D, Zhang Y, Klein JM, Horton A, Adhikari L, Zelovich T, Doherty BW. Deep eutectic solvents: A review of fundamentals and applications. Chem Rev. 2020;121(3):1232-85

[17]. Smith EL, Abbott AP, Ryder KS. Deep eutectic solvents (DESs) and their applications. Chem Rev. 2014;114(21):11060-82

[18]. Omar KA, Sadeghi R. Physicochemical properties of deep eutectic solvents: A review. J Mol Liq. 2022;360:119524

[19]. Prabhune A, Dey R. Green and sustainable solvents of the future: Deep eutectic solvents. J Mol Liq. 2023;379:121676

[20]. Zaytsev OI, Ehrenburg MR, Molodkina EB, Broekmann P, Rudnev AV. Over-and underpotential deposition of copper from a deep eutectic solvent: Pt (1 1 1) single crystal versus polycrystalline Pt substrates. J Electroanal Chem. 2022;926:116940

[21]. Bernasconi R, Zebarjadi M, Magagnin L. Copper electrodeposition from a chloride free deep eutectic solvent. J Electroanal Chem. 2015;758:163-9

[22]. Giurlani W, Fidi A, Anselmi E, Pizzetti F, Bonechi M, Carretti E, Nostro PL, Innocenti M. Specific ion effects on copper electroplating. Colloids and Surfaces B: Biointerfaces. 2023;225:113287

[23]. Vasiljevic N, Wood M, Heard P, Schwarzacher W. The influence of specific anion adsorption on the surface roughness of electrodeposited polycrystalline Cu films. J Electrochem Soc. 2010;157(4):D193

[24]. Jiang F, Zhu T, Kuang Y, Wu H, Li S. Superhydrophobic copper coating with ultrahigh corrosion resistance by electrodeposition process in a deep eutectic solvent. Chem Phys Lett. 2023;811:140197

[25]. Abbott AP, El Ttaib K, Frisch G, McKenzie KJ, Ryder KS. Electrodeposition of copper composites from deep eutectic solvents based on choline chloride. Physical Chemistry Chemical Physics. 2009;11(21):4269-77

[26]. Cvetković VS, Jović VD, Nikolić ND, Barudžija TS, Dimitrijević S, Jovićević JN. Electrodeposition of copper on glassy carbon and palladium from choline chloride-ethylene glycol deep eutectic solvent. J Electroanal Chem. 2024;958:118161

[27]. Vukmirovic MB, Adzic RR, Akolkar R. Copper electrodeposition from deep eutectic solvents—voltammetric studies providing insights into the role of substrate: platinum vs glassy carbon. The Journal of Physical Chemistry B. 2020;124(26):5465-75

[28]. De Vreese P, Brooks NR, Van Hecke K, Van Meervelt L, Matthijs E, Binnemans K, Van Deun R. Speciation of copper (II) complexes in an ionic liquid based on choline chloride and in choline chloride/water mixtures. Inorg Chem. 2012;51(9):4972-81

[29]. Valverde P, Green T, Roy S. Effect of water on the electrodeposition of copper from a deep eutectic solvent. J Appl Electrochem. 2020;50:699-712

[30]. Batool M, Haider MN, Javed T. Applications of spectroscopic techniques for characterization of polymer nanocomposite: A review. Journal of Inorganic and Organometallic Polymers and Materials. 2022;32(12):4478-503

[31]. Abdulsahib WK, Sahib HH, Mahdi MA, Jasim LS. Adsorption Study of Cephalexin Monohydrate Drug in Solution on Poly (vinyl pyrrolidone-acryl amide) Hydrogel Surface. International Journal of Drug Delivery Technology. 2021;11(4):1169-72.

[32]. Radhy ND, Jasim LS. A novel economical friendly treatment approach: Composite hydrogels. Caspian Journal of Environmental Sciences. 2021;19(5):841-52.

[33]. Karim AN, Jasim LS. Synthesis and characterization of poly (CH/AA-co-AM) composite: Adsorption and thermodynamic studies of benzocaine on from aqueous solutions. International Journal of Drug Delivery Technology. 2019;9(4):558-62.

[34]. Mahdi MA, Oroumi G, Samimi F, Dawi EA, Abed MJ, Alzaidy AH, et al. Tailoring the innovative Lu2CrMnO6 double perovskite nanostructure as an efficient electrode materials for electrochemical hydrogen storage application. Journal of Energy Storage. 2024;88.

[35]. Hosseini M, Ghanbari M, Dawi EA, Mahdi MA, Ganduh SH, Jasim LS, et al. Investigations of nickel silicate for degradation of water-soluble organic pollutants. International Journal of Hydrogen Energy. 2024;61:307-15.



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